Seguir
Shidong Li
Shidong Li
IBM, University at Buffalo, Tongji University
E-mail confirmado em us.ibm.com
Título
Citado por
Citado por
Ano
Quantitative description of the effect of molecular size upon electroosmotic flux enhancement during iontophoresis for a synthetic membrane and human epidermal membrane
KD Peck, V Srinivasan, SK Li, WI Higuchi, AH Ghanem
Journal of pharmaceutical sciences 85 (7), 781-788, 1996
561996
A computational damage mechanics model for thermomigration
S Li, C Basaran
Mechanics of Materials 41 (3), 271-278, 2009
542009
Method and apparatus for audio error concealment using data hiding
S Cheng, HH Yu, Z Xiong
US Patent 7,047,187, 2006
532006
Thermomigration induced degradation in solder alloys
C Basaran, S Li, MF Abdulhamid
Journal of Applied Physics 103 (12), 2008
522008
Lattice strain due to an atomic vacancy
S Li, MS Sellers, C Basaran, AJ Schultz, DA Kofke
International journal of molecular sciences 10 (6), 2798-2808, 2009
482009
Fluorescent probe studies of the interactions of 1‐alkyl‐2‐pyrrolidones with stratum corneum lipid liposomes
K Yoneto, S Kevin LI, WI Higuchi, W Jiskoot, JN Herron
Journal of pharmaceutical sciences 85 (5), 511-517, 1996
451996
Assessment of PLGA-PEG-PLGA copolymer hydrogel for sustained drug delivery in the ear
L Feng, J A Ward, S Kevin Li, G Tolia, J Hao, D I Choo
Current drug delivery 11 (2), 279-286, 2014
392014
Pore charge distribution considerations in human epidermal membrane electroosmosis
SK Li, AH Ghanem, WI Higuchi
Journal of pharmaceutical sciences 88 (10), 1044-1049, 1999
371999
Damage mechanics of low temperature electromigration and thermomigration
S Li, MF Abdulhamid, C Basaran
IEEE Transactions on Advanced Packaging 32 (2), 478-485, 2009
332009
Mechanistic study of chemical skin permeation enhancers with different polar and lipophilic functional groups
N He, KS Warner, D Chantasart, DS Shaker, WI Higuchi, SK Li
Journal of pharmaceutical sciences 93 (6), 1415-1430, 2004
332004
Multichip module with stiffening frame and associated covers
S Li, GB Monjeau, KK Sikka, HT Toy, T Weiss
US Patent 9,089,051, 2015
322015
Investigation of pH influence on skin permeation behavior of weak acids using nonsteroidal anti-inflammatory drugs
D Chantasart, S Chootanasoontorn, J Suksiriworapong, S Kevin Li
Journal of pharmaceutical sciences 104 (10), 3459-3470, 2015
302015
Electromigration time to failure of SnAgCuNi solder joints
C Basaran, S Li, DC Hopkins, D Veychard
Journal of Applied Physics 106 (1), 2009
292009
Simulating damage mechanics of electromigration and thermomigration
S Li, MF Abdulhamid, C Basaran
Simulation 84 (8-9), 391-401, 2008
292008
Effective diffusivity of lead free solder alloys
S Li, C Basaran
Computational materials science 47 (1), 71-78, 2009
252009
Thermomigration in lead-free solder joints
MF Abdulhamid, S Li, C Basaran
International Journal of Materials and Structural Integrity 2 (1-2), 11-34, 2008
212008
Rational Be´ zier Line-Symmetric Motions
S Li, QJ Ge
J. Mech. Des. 127 (2), 222-226, 2005
202005
Residual fatigue life prediction based on a novel damage accumulation model considering loading history
Z Li, D Shi, S Li, X Yang
Fatigue & Fracture of Engineering Materials & Structures 43 (5), 1005-1021, 2020
192020
Thermodynamics theory for damage evolution in solids
C Basaran, S Nie, J Gomez, E Gunel, S Li, M Lin, H Tang, C Yan, W Yao, ...
Springer New York, 2015
192015
Seasonal change of soil microbial biomass and the relationship between soil microbial biomass and soil moisture and temperature
S LI, S REN, S LI
Journal of Plant Nutrition and Fertilizers 10 (1), 18-23, 2004
192004
O sistema não pode executar a operação agora. Tente novamente mais tarde.
Artigos 1–20