| Understanding and preventing Cu–Sn micro joint defects through design and process control M Njuki, S Thekkut, R Das, N Shahane, P Thompson, K Mirpuri, ... Journal of Applied Electrochemistry, 1-13, 2022 | 14 | 2022 |
| Enhanced voiding in Cu-Sn micro joints M Njuki, S Thekkut, R Sivasubramony, CM Greene, N Shahane, ... Materials Research Bulletin 150, 111759, 2022 | 11 | 2022 |
| Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints S Thekkut, R Das, M Njuki, J Li, RS Sivasubramony, FW Alshatnawi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 485-491, 2020 | 7 | 2020 |
| Preventing Void Growth Between Ni3Sn4 and Solder M Njuki, S Thekkut, R Das, P Borgesen, N Dimitrov Journal of Electronic Materials 51 (11), 6333-6346, 2022 | 6 | 2022 |
| Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics E Castillo, M Njuki, AF Pasha, N Dimitrov Accounts of Chemical Research 56 (12), 1384-1394, 2023 | 5 | 2023 |
| A Study of Reliability Issues in Alternative Fine Pitch Solder Joint Interconnect Technology for System-In-Packages (SIPS) MM Njuki State University of New York at Binghamton, 2023 | 1 | 2023 |
| Factors Controlling the Defect Formation in Cu-Sn Micro Joints in 2.5 D and 3D Interconnects M Njuki, S Thekkut, P Borgesen, N Dimitrov Electrochemical Society Meeting Abstracts 240, 930-930, 2021 | 1 | 2021 |
| All-Electrochemical Synthesis of SnBi/SnAgCu Structures for Low-Temperature Formation of High-Reliability Solder Microjoints M Njuki, A Pasha, R Das, P Borgesen, N Dimitrov Journal of Alloys and Compounds, 174699, 2024 | | 2024 |
| Nanoporous Cu-Sn Intermetallic Material for Interconnects in Electronic Packaging N Dimitrov, E Castillo, M Njuki, AF Pasha Electrochemical Society Meeting Abstracts 244, 1279-1279, 2023 | | 2023 |
| Void Formation in Ni3Sn4 based Micro Joints | | |
Nikolay G DimitrovProfessor, Binghamton University, SUNYVerified email at binghamton.edu
