Citado por
Citado por
Development and evaluation of simplified procedures for the analysis and design of buildings with passive energy dissipation systems.
OM Ramirez
Evaluation of simplified methods of analysis of yielding structures with damping systems
OM Ramirez, MC Constantinou, JD Gomez, AS Whittaker, ...
Earthquake Spectra 18 (3), 501-530, 2002
Shear wave filtering in naturally-occurring Bouligand structures
N Guarín-Zapata, J Gomez, N Yaraghi, D Kisailus, PD Zavattieri
Acta biomaterialia 23, 11-20, 2015
A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects
J Gomez, C Basaran
International Journal of Solids and Structures 42 (13), 3744-3772, 2005
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
J Gomez, C Basaran
Mechanics of Materials 38 (7), 585-598, 2006
Nanoindentation of Pb/Sn solder alloys; experimental and finite element simulation results
J Gomez, C Basaran
International journal of solids and structures 43 (6), 1505-1527, 2006
A damage-mechanics-based constitutive model for solder joints
C Basaran, Y Zhao, H Tang, J Gomez
Journal of Electronic Packaging 127, 208, 2005
High-temperature, high-density packaging of a 60kW converter for> 200 C embedded operation
DC Hopkins, DW Kellerman, RA Wunderlich, C Basaran, CJ Gomez
Applied Power Electronics Conference and Exposition, 2006. APEC'06. Twenty …, 2006
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
C Basaran, J Gomez, M Lin, S Li
2007 Summer Computer Simulation Conference, 269-275, 2007
Damage Mechanics Modeling of Concurrent Thermal and Vibration Loadings on Electronic Packages with Solder Alloys Interconnects
J Gomez, M Lin, C Basaran
Multidiscipline Modeling in Materials and Structures 2 (3), 309-326, 2006
Determination of strain gradient plasticity length scale for microelectronics solder alloys
J Gomez, C Basaran
Journal of electronic packaging 129 (2), 120-128, 2007
Effects of realistic topography on the ground motion of the Colombian Andes–A case study at the Aburrá Valley, Antioquia
D Restrepo, J Bielak, R Serrano, J Gómez, J Jaramillo
Geophysical Journal International 204 (3), 1801-1816, 2016
Analytic approximation to the scattering of antiplane shear waves by free surfaces of arbitrary shape via superposition of incident, reflected and diffracted rays
J Jaramillo, J Gomez, M Saenz, J Vergara
Geophysical Journal International, ggs061, 2013
Thermodynamic Theory for Damage Evolution in Solids
C Basaran, S Nie, J Gomez, E Gunel, S Li, M Lin, H Tang, C Yan, W Yao, ...
Handbook of Damage Mechanics. Nano to macroscales for materials and …, 2014
Development and evaluation of simplified procedures of analysis and design for structures with passive energy dissipation systems
OM Ramirez, MC Constantinou, CA Kircher, A Whittaker, M Johnson, ...
Technical Rep. No. MCEER-00–0010, Revision 1, 2001
Computational characterization of the wave propagation behaviour of multi-stable periodic cellular materials
C Valencia, D Restrepo, N Mankame, P Zavattieri, J Gomez
Extreme Mechanics Letters 33, 100565, 2019
Evaluation of the Spectral Finite Element Method with the Theory of Phononic Crystals
N Guarín-Zapata, J Gomez
Journal of Computational Acoustics 23, 1550004-1-1550004-17, 2015
Computational implementation of Cosserat continuum
J Gomez, C Basaran
International Journal of Materials and Product Technology 34 (1-2), 3-36, 2009
Aluminum-Based High-Temperature (> 200 C) Packaging for SiC Power Converters
DC Hopkins, DW Kellerman, C Basaran, J Gomez
Proceedings of the 2006 International Symposium on Microelectronics (IMAPS …, 2006
SH Wave Number Green’s Function for a Layered, Elastic Half-Space. Part I: Theory and Dynamic Canyon Response by the Discrete Wave Number Boundary Element Method
D Restrepo, JD Gómez, JD Jaramillo
Pure and Applied Geophysics, 1-14, 2014
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