| Mechanical Properties of Nanoporous Gold in Tension N Badwe, X Chen, K Sieradzki Acta Materialia, 2017 | 128 | 2017 |
| Potential-dependent dynamic fracture of nanoporous gold S Sun, X Chen, N Badwe, K Sieradzki Nature materials 14 (9), 894-898, 2015 | 95 | 2015 |
| Decoupling the role of stress and corrosion in the intergranular cracking of noble-metal alloys N Badwe, X Chen, D Schreiber, M Olszta, N Overman, E Karasz, A Tse, ... Nature Materials, 2018 | 77 | 2018 |
| Low temperature solder-a breakthrough technology for surface mounted devices S Sahasrabudhe, S Mokler, M Renavikar, S Sane, K Byrd, E Brigham, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1455-1464, 2018 | 48 | 2018 |
| Interfacial fracture strength and toughness of copper/epoxy-resin interfaces N Badwe, R Mahajan, K Sieradzki Acta Materialia 103, 512-518, 2016 | 23 | 2016 |
| Dynamic fracture and dealloying induced stress-corrosion cracking X Chen, E Karasz, N Badwe, K Sieradzki Corrosion Science 187, 109503, 2021 | 14 | 2021 |
| Influence of pad surface finish on the microstructure evolution and intermetallic compound growth in homogeneous Sn-Bi and Sn-Bi-Ag solder interconnects Y Fan, Y Wu, TF Dale, SAP Lakshminarayana, CV Greene, NU Badwe, ... Journal of Electronic Materials 50, 6615-6628, 2021 | 10 | 2021 |
| Low temperature lead‐free alloys and solder pastes R Aspandiar, N Badwe, K Byrd Lead‐free Soldering Process Development and Reliability, 95-154, 2020 | 4 | 2020 |
| Fracture of nanoporous gold N Badwe Arizona State University, 2014 | 4 | 2014 |
| High-temperature mechanical properties and fatigue of nanocrystalline nickel-cobalt-phosphorous (NiCoP) alloy N Badwe, P Daharwal, T Rawlings, P Diglio, S Wozny, M Khurana, ... Materialia 18, 101136, 2021 | 3 | 2021 |
| Comparative mechanical behavior of Sn-Bi based low temperature solder alloys under different pretest aging conditions SA PL, CV Greene, SY Lai, R Radulescu, H Fowler, J Blendell, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2218-2222, 2023 | 2 | 2023 |
| Thermal cycling induced interconnect stability degradation mechanism in low melting temperature solder joints K Young, R Aspandiar, N Badwe, S Walwadkar, YW Lee, TK Lee 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1199-1205, 2022 | 1 | 2022 |
| Intermetallic compound growth and gold embrittlement effect in tin-bismuth low temperature solders on electroless nickel immersion gold (ENIG) surface finish Y Fan, Y Wu, T Dale, S Achar, N Badwe, R Aspandiar, J Blendell, ... Proceedings of SMTA International, 2020 | | 2020 |
| Wetting Characteristics of SnBi Low Temperature Solder on Different Surface Finishes P Goonetilleke, N Badwe, K Byrd, M Truong Proceedings of SMTA International, 2020 | | 2020 |
| Thermal Cycle and Drop Shock Performance of Homogeneous SnBi LTS and SAC Solder Joints N Badwe, J Stafford, R Sidhu, J Cook, P Goonetilleke Proceedings of SMTA International, 2020 | | 2020 |
| Low Temperature Solder Paste Transfer Efficiency Characterization and Area Ratio Limits A Prasad, X Chen, N Badwe, K Byrd Proceedings of SMTA International, 2019 | | 2019 |
| Root Cause and Solution to Mitigate the Hot Tear Defect Mode in Hybrid SAC-Low Temp Solder Joints T Harris, K Byrd, N Badwe Proceedings of SMTA International, 2019 | | 2019 |
| Tin-Bismuth Low Temperature Homogeneous Second Level Interconnect Solder Joint Microstructure, Reliability, and Failure Mechanism N Badwe, K Byrd, O Jin, P Goonetilleke Proceedings of SMTA International, 2019 | | 2019 |
| Thermodynamic and Kinetic Effects on Microstructure Evolution in Hybrid Low Temperature Solder/High-Sn Solder Joints Y Fan, Y Wu, JE Blendell, N Badwe, CA Handwerker 2019 6th International Workshop on Low Temperature Bonding for 3D …, 2019 | | 2019 |
| Solder Paste: Fundamental Material Property/SMT Performance Correlation N Badwe, S Cheng, S Aravamudhan, M Renavikar Proceedings of SMTA International, 2018 | | 2018 |
Karl SieradzkiArizona State UniversityE-mail confirmado em asu.edu
