| Role of hydrogen bonding on the adsorption of several amino acids on SiO2 and Si3N4 and selective polishing of these materials using ceria dispersions NK Penta, BC Peethala, HP Amanapu, A Melman, SV Babu Colloids and Surfaces A: Physicochemical and Engineering Aspects 429, 67-73, 2013 | 35 | 2013 |
| Role of poly (diallyldimethylammonium chloride) in selective polishing of polysilicon over silicon dioxide and silicon nitride films NK Penta, PR Dandu Veera, SV Babu Langmuir 27 (7), 3502-3510, 2011 | 35 | 2011 |
| Use of anionic surfactants for selective polishing of silicon dioxide over silicon nitride films using colloidal silica-based slurries NK Penta, HP Amanapu, BC Peethala, SV Babu Applied surface science 283, 986-992, 2013 | 30 | 2013 |
| Role of polycation adsorption in poly-Si, SiO2 and Si3N4 removal during chemical mechanical polishing: Effect of polishing pad surface chemistry NK Penta, JB Matovu, PRD Veera, S Krishnan, SV Babu Colloids and Surfaces A: Physicochemical and Engineering Aspects 388 (1-3 …, 2011 | 30 | 2011 |
| Chemical mechanical polishing of Ge in hydrogen peroxide-based silica slurries: role of ionic strength JB Matovu, NK Penta, S Peddeti, SV Babu Journal of The Electrochemical Society 158 (11), H1152, 2011 | 29 | 2011 |
| Charge Density and pH Effects on Polycation Adsorption on Poly-Si, SiO2, and Si3N4 Films and Impact on Removal During Chemical Mechanical Polishing NK Penta, PRD Veera, SV Babu ACS applied materials & interfaces 3 (10), 4126-4132, 2011 | 25 | 2011 |
| Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing PRV Dandu, BC Peethala, NK Penta, SV Babu Colloids and Surfaces A: Physicochemical and Engineering Aspects 366 (1-3 …, 2010 | 17 | 2010 |
| Novel α-amine-functionalized silica-based dispersions for selectively polishing polysilicon and Si (1 0 0) over silicon dioxide, silicon nitride or copper during chemical … PRV Dandu, NK Penta, SV Babu Colloids and Surfaces A: Physicochemical and Engineering Aspects 371 (1-3 …, 2010 | 15 | 2010 |
| Further investigation of slurry additives for selective polishing of SiO2 films over Si3N4 using ceria dispersions NK Penta, HP Amanapu, SV Babu ECS Journal of Solid State Science and Technology 4 (11), P5025, 2015 | 13 | 2015 |
| Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films PRV Dandu, NK Penta, BC Peethala, SV Babu Journal of colloid and interface science 348 (1), 114-118, 2010 | 13 | 2010 |
| Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes NK Penta Advances in chemical mechanical planarization (CMP), 213-227, 2016 | 8 | 2016 |
| Reactive liquids for non–prestonian chemical mechanical polishing of polysilicon films URK Lagudu, S Korkmaz, A Gowda, NK Penta, SV Babu ECS Journal of Solid State Science and Technology 8 (5), P3040, 2019 | 7 | 2019 |
| Tunable polish rates by varying dissolved oxygen content PRV Dandu, NK Penta, BV Suryadevara, URK Lagudu US Patent 8,778,203, 2014 | 7 | 2014 |
| Abrasive Free Silicon Chemical Mechanical Planarization NK Penta, SV Babu US Patent App. 13/356,980, 2012 | 7 | 2012 |
| Development of post-CMP cleaners for better defect performance C Tran, P Zhang, L Sun, NK Penta, URK Lagudu, D Shipp, SV Babu ECS Transactions 44 (1), 565, 2012 | 6 | 2012 |
| Low-abrasive CMP slurry compositions with tunable selectivity Y Guo, D Mosley, NK Penta US Patent 10,119,048, 2018 | 5 | 2018 |
| Chemical mechanical polishing composition for polishing silicon wafers and related methods Y Itai, NK Penta, N Kawai, H Nakano, S Haba, Y Ota, T Matsushita, ... US Patent 9,150,759, 2015 | 3 | 2015 |
| Silicon wafer polishing composition and related methods NK Penta, LM Cook US Patent 8,795,548, 2014 | 1 | 2014 |
| Aqueous anionic functional silica slurry and amine carboxylic acid compositions for selective nitride removal in polishing and methods of using them NK Penta US Patent 11,186,748, 2021 | | 2021 |
| Dow Electronic Materials, Newark, DE, United States NK Penta Advances in Chemical Mechanical Planarization (CMP), 221, 2021 | | 2021 |
S.V. BabuClarkson UniversityE-mail confirmado em clarkson.edu
