| Computational damage mechanics of electromigration and thermomigration W Yao, C Basaran Journal of Applied Physics 114 (10), 2013 | 77 | 2013 |
| Electromigration analysis of solder joints under ac load: A mean time to failure model W Yao, C Basaran Journal of Applied Physics 111 (6), 2012 | 56 | 2012 |
| Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model W Yao, C Basaran Computational Materials Science 71, 76-88, 2013 | 38 | 2013 |
| Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study W Yao, C Basaran International Journal of Damage Mechanics 23 (2), 203-221, 2014 | 28 | 2014 |
| Thermodynamics theory for damage evolution in solids C Basaran, S Nie, J Gomez, E Gunel, S Li, M Lin, H Tang, C Yan, W Yao, ... Springer New York, 2015 | 19 | 2015 |
| Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study W Yao, C Basaran International Journal of Damage Mechanics 22 (8), 1127-1143, 2013 | 11 | 2013 |
| Reduced impedance and superconductivity of SnAgCu solder alloy at high frequency W Yao, C Basaran Electronic Materials Letters 8, 503-505, 2012 | 11 | 2012 |
| Electric pulse induced impedance and material degradation in IC chip packaging W Yao, C Basaran Electronic Materials Letters 9, 565-568, 2013 | 7 | 2013 |
| Damage of SAC405 solder joint under PDC W Yao, C Basaran 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 6 | 2012 |
| Skin effect and material degradation of lead-free solder joint under AC Y Wei, B Cemal 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 5 | 2012 |
| Mean time to failure of SnAgCuNi solder joints under DC C Basaran, S Li, DC Hopkins, W Yao 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 4 | 2012 |
