| Lab-on-a-chip devices: How to close and plug the lab? Y Temiz, RD Lovchik, GV Kaigala, E Delamarche Microelectronic engineering 132, 156-175, 2015 | 563 | 2015 |
| A compact angular rate sensor system using a fully decoupled silicon-on-glass MEMS gyroscope SE Alper, Y Temiz, T Akin Journal of Microelectromechanical systems 17 (6), 1418-1429, 2008 | 122 | 2008 |
| Self-coalescing flows in microfluidics for pulse-shaped delivery of reagents O Gökçe, S Castonguay, Y Temiz, T Gervais, E Delamarche Nature 574 (7777), 228-232, 2019 | 58 | 2019 |
| Sub-nanoliter, real-time flow monitoring in microfluidic chips using a portable device and smartphone Y Temiz, E Delamarche Scientific reports 8 (1), 10603, 2018 | 53 | 2018 |
| Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks T Brunschwiler, S Paredes, U Drechsler, B Michel, W Cesar, G Toral, ... 2009 IEEE International Conference on 3D System Integration, 1-10, 2009 | 48 | 2009 |
| Transposing lateral flow immunoassays to capillary-driven microfluidics using self-coalescence modules and capillary-assembled receptor carriers E Hemmig, Y Temiz, O Gökçe, RD Lovchik, E Delamarche Analytical chemistry 92 (1), 940-946, 2019 | 46 | 2019 |
| A comparative study on fabrication techniques for on-chip microelectrodes Y Temiz, A Ferretti, Y Leblebici, C Guiducci Lab on a Chip 12 (22), 4920-4928, 2012 | 44 | 2012 |
| Towards thermally-aware design of 3D MPSoCs with inter-tier cooling MM Sabry, A Sridhar, D Atienza, Y Temiz, Y Leblebici, S Szczukiewicz, ... 2011 Design, Automation & Test in Europe, 1-6, 2011 | 36 | 2011 |
| Electro-actuated valves and self-vented channels enable programmable flow control and monitoring in capillary-driven microfluidics Y Arango, Y Temiz, O Gökçe, E Delamarche Science advances 6 (16), eaay8305, 2020 | 33 | 2020 |
| A 0.18 Biosensor Front-End Based on Noise, Distortion Cancelation and Chopper Stabilization Techniques V Balasubramanian, PF Ruedi, Y Temiz, A Ferretti, C Guiducci, CC Enz IEEE transactions on biomedical circuits and systems 7 (5), 660-673, 2013 | 32 | 2013 |
| An SOI-MEMS tuning fork gyroscope with linearly coupled drive mechanism K Azgin, Y Temiz, T Akin 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems …, 2007 | 31 | 2007 |
| Resistive programmable through-silicon vias for reconfigurable 3-D fabrics D Sacchetto, M Zervas, Y Temiz, G De Micheli, Y Leblebici IEEE transactions on nanotechnology 11 (1), 8-11, 2011 | 27 | 2011 |
| ‘Chip-olate’and dry-film resists for efficient fabrication, singulation and sealing of microfluidic chips Y Temiz, E Delamarche Journal of Micromechanics and Microengineering 24 (9), 097001, 2014 | 26 | 2014 |
| Design and testing strategies for modular 3-D-multiprocessor systems using die-level through silicon via technology G Beanato, P Giovannini, A Cevrero, P Athanasopoulos, M Zervas, ... IEEE Journal on Emerging and Selected Topics in Circuits and Systems 2 (2 …, 2012 | 24 | 2012 |
| Immuno-gold silver staining assays on capillary-driven microfluidics for the detection of malaria antigens NM Pham, S Rusch, Y Temiz, HP Beck, W Karlen, E Delamarche Biomedical Microdevices 21, 1-10, 2019 | 20 | 2019 |
| Electrogates for stop-and-go control of liquid flow in microfluidics Y Arango, Y Temiz, O Gökçe, E Delamarche Applied Physics Letters 112 (15), 2018 | 20 | 2018 |
| Die-level TSV fabrication platform for CMOS-MEMS integration Y Temiz, M Zervas, C Guiducci, Y Leblebici 2011 16th International Solid-State Sensors, Actuators and Microsystems …, 2011 | 20 | 2011 |
| Fabrication and characterization of wafer-level deep TSV arrays M Zervas, Y Temiz, Y Leblebici 2012 IEEE 62nd Electronic Components and Technology Conference, 1625-1630, 2012 | 19 | 2012 |
| Post-CMOS processing and 3-D integration based on dry-film lithography Y Temiz, C Guiducci, Y Leblebici IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (9 …, 2013 | 18 | 2013 |
| 3D integration technology for lab-on-a-chip applications Y Temiz, S Kilchenmann, Y Leblebici, C Guiducci Electronics letters 47 (26), 22-24, 2011 | 17 | 2011 |
