| Advancements in silver wire bonding S Manoharan, C Patel, P McCluskey International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 18 | 2017 |
| Failure mechanisms in encapsulated copper wire-bonded devices S Manoharan, G Krishnanramaswami, FP Mccluskey, MG Pecht 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis …, 2016 | 18 | 2016 |
| Aging characteristics of green mold compound for use in encapsulation of microelectronic devices S Manoharan, C Patel, S Dunford, C Morillo, P McCluskey 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1768-1773, 2018 | 15 | 2018 |
| Mechanism of wire bond shear testing S Manoharan, C Patel, S Hunter, P McCluskey Microelectronics Reliability 88, 738-744, 2018 | 13 | 2018 |
| Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment S Manoharan, C Patel, P McCluskey, M Pecht Microelectronics Reliability 84, 197-207, 2018 | 11 | 2018 |
| Decapsulation of plastic encapsulated microelectronics with copper wire bonds S Manoharan, C Patel, P McCluskey Additional Papers and Presentations 2016 (HiTEC), 000092-000096, 2016 | 10 | 2016 |
| Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA) S Manoharan, C Patel, S Dunford, J Beshears, P McCluskey Microelectronics Reliability 99, 137-151, 2019 | 9 | 2019 |
| Bond pad effects on the shear strength of copper wire bonds S Manoharan, S Hunter, P McCluskey 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-6, 2017 | 8 | 2017 |
| Effects of bond pad thickness on shear strength of copper wire bonds S Manoharan, C Patel, S Hunter, P McCluskey Additional Papers and Presentations 2017 (HiTEN), 000068-000073, 2017 | 7 | 2017 |
| Mechanics of copper wire bond failure due to thermal fatigue S Manoharan, NMJ Li, C Patel, S Hunter, P McCluskey 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 874-881, 2018 | 6 | 2018 |
| Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs) NM Li, S Manoharan, D Das, P McCluskey Microelectronics Reliability 88, 528-533, 2018 | 6 | 2018 |
| Influence of initial shear strength on time-to-failure of copper (Cu) wire bonds in thermal aging condition S Manoharan, C Patel, S Hunter, P McCluskey Additional Papers and Presentations 2018 (HiTEC), 000032-000038, 2018 | 5 | 2018 |
| INTERFACIAL DEGRADATION OF COPPER WIRE BONDS IN THERMAL AGING AND CYCLING CONDITION S Manoharan | 1 | 2019 |
| Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn E Gutierrez, S Manoharan, M Serebreni, P McCluskey International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 1 | 2018 |
| Decapsulation of Copper Wire Bonded Devices FP McCluskey, S Manoharan | | 2017 |
Patrick McCluskeyProfessor, University of Maryland, College ParkE-mail confirmado em umd.edu
