| Interface traps density-of-states as a vital component for hot-carrier degradation modeling SE Tyaginov, IA Starkov, O Triebl, J Cervenka, C Jungemann, S Carniello, ... Microelectronics Reliability 50 (9-11), 1267-1272, 2010 | 78 | 2010 |
| A comprehensive TCAD approach for assessing electromigration reliability of modern interconnects H Ceric, RL de Orio, J Cervenka, S Selberherr IEEE Transactions on Device and Materials Reliability 9 (1), 9-19, 2008 | 64 | 2008 |
| Hot-carrier degradation caused interface state profile—Simulation versus experiment I Starkov, S Tyaginov, H Enichlmair, J Cervenka, C Jungemann, ... Journal of Vacuum Science & Technology B 29 (1), 2011 | 45 | 2011 |
| Hot-carrier degradation modeling using full-band Monte-Carlo simulations SE Tyaginov, IA Starkov, O Triebl, J Cervenka, C Jungemann, S Carniello, ... 2010 17th IEEE International Symposium on the Physical and Failure Analysis …, 2010 | 27 | 2010 |
| Modeling of deep-submicron silicon-based MISFETs with calcium fluoride dielectric SE Tyaginov, YY Illarionov, MI Vexler, M Bina, J Cervenka, J Franco, ... Journal of Computational Electronics 13, 733-738, 2014 | 12 | 2014 |
| Quantum correction for DG MOSFETs M Wagner, M Karner, J Cervenka, M Vasicek, H Kosina, S Holzer, ... Journal of Computational Electronics 5, 397-400, 2006 | 11 | 2006 |
| The effect of copper grain size statistics on the electromigration lifetime distribution RL de Orio, H Ceric, J Cervenka, S Selberherr 2009 International Conference on Simulation of Semiconductor Processes and …, 2009 | 10 | 2009 |
| Applicability of macroscopic transport models to decananometer MOSFETs M Vasicek, J Cervenka, D Esseni, P Palestri, T Grasser IEEE transactions on electron devices 59 (3), 639-646, 2012 | 9 | 2012 |
| Three-dimensional mesh generation for device and process simulation J Cervenka na, 2004 | 9 | 2004 |
| Numerical constraints and non-spatial open boundary conditions for the Wigner equation R Kosik, J Cervenka, H Kosina Journal of Computational Electronics 20 (6), 2052-2061, 2021 | 8 | 2021 |
| A 2D non-parabolic six-moments model M Vasicek, J Cervenka, M Wagner, M Karner, T Grasser Solid-state electronics 52 (10), 1606-1609, 2008 | 8 | 2008 |
| Anisotropic mesh refinement for the simulation of three-dimensional semiconductor manufacturing processes W Wessner, J Cervenka, C Heitzinger, A Hossinger, S Selberherr IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2006 | 8 | 2006 |
| TCAD simulation of tunneling leakage current in CaF2/Si (111) MIS structures YY Illarionov, MI Vexler, M Karner, SE Tyaginov, J Cervenka, T Grasser Current Applied Physics 15 (2), 78-83, 2015 | 7 | 2015 |
| A study of boron implantation into high Ge content SiGe alloys R Wittmann, S Uppal, A Hoessinger, J Cervenka, S Selberherr ECS Transactions 3 (7), 667, 2006 | 7 | 2006 |
| Deterministic solution of the discrete Wigner equation J Cervenka, P Ellinghaus, M Nedjalkov Numerical Methods and Applications: 8th International Conference, NMA 2014 …, 2015 | 6 | 2015 |
| Copper microstructure impact on evolution of electromigration induced voids H Ceric, RL de Orio, J Cervenka, S Selberherr 2009 International Conference on Simulation of Semiconductor Processes and …, 2009 | 6 | 2009 |
| A revised Wigner function approach for stationary quantum transport R Kosik, J Cervenka, M Thesberg, H Kosina International Conference on Large-Scale Scientific Computing, 403-410, 2019 | 5 | 2019 |
| Analysis of worst-case hot-carrier conditions for high voltage transistors based on full-band monte-carlo simulations IA Starkov, SE Tyaginov, O Triebl, J Cervenka, C Jungemann, S Carniello, ... 2010 17th IEEE International Symposium on the Physical and Failure Analysis …, 2010 | 5 | 2010 |
| Generation of unstructured meshes for process and device simulation by means of partial differential equations J Cervenka, W Wessner, E Al-Ani, T Grasser, S Selberherr IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2006 | 5 | 2006 |
| Stress‐Induced Anisotropy of Electromigration in Copper Interconnects H Ceric, RL de Orio, J Cervenka, S Selberherr AIP Conference Proceedings 1143 (1), 56-62, 2009 | 4 | 2009 |
