Transmission EBSD from 10 nm domains in a scanning electron microscope RR Keller, RH Geiss Journal of Microscopy 245 (3), 245-251, 2012 | 476 | 2012 |
Tensile properties of free-standing aluminum thin films DT Read, YW Cheng, RR Keller, JD McColskey Scripta Materialia 45 (5), 583-589, 2001 | 119 | 2001 |
Tensile and fracture behavior of free-standing copper films RR Keller, JM Phelps, DT Read Materials Science and Engineering: A 214 (1-2), 42-52, 1996 | 116 | 1996 |
Thermal fatigue testing of thin metal films R Mönig, RR Keller, CA Volkert Review of Scientific Instruments 75 (11), 4997-5004, 2004 | 111 | 2004 |
EBSD measurement of strains in GaAs due to oxidation of buried AlGaAs layers RR Keller, A Roshko, RH Geiss, KA Bertness, TP Quinn Microelectronic engineering 75 (1), 96-102, 2004 | 94 | 2004 |
Characterization of interfacial dislocation networks in a creep-deformed nickel-base superalloy RR Keller, HJ Maier, H Mughrabi Scripta metallurgica et materialia 28 (1), 23-28, 1993 | 92 | 1993 |
Grain boundary misorientation angles and stress-induced voiding in oxide passivated copper interconnects JA Nucci, RR Keller, DP Field, Y Shacham-Diamand Applied physics letters 70 (10), 1242-1244, 1997 | 85 | 1997 |
Electrical properties of superfilled sub-micrometer silver metallizations D Josell, C Burkhard, Y Li, YW Cheng, RR Keller, CA Witt, DR Kelley, ... Journal of applied physics 96 (1), 759-768, 2004 | 66 | 2004 |
Epitaxial (111) films of Cu, Ni, and CuxNiy on α− Al2O3 (0001) for graphene growth by chemical vapor deposition DL Miller, MW Keller, JM Shaw, AN Chiaramonti, RR Keller Journal of Applied Physics 112 (6), 2012 | 65 | 2012 |
Local crystallographic texture and voiding in passivated copper interconnects JA Nucci, RR Keller, JE Sanchez Jr, Y Shacham‐Diamand Applied physics letters 69 (26), 4017-4019, 1996 | 63 | 1996 |
Specimen‐thickness effects on transmission Kikuchi patterns in the scanning electron microscope KP Rice, RR Keller, MP Stoykovich Journal of microscopy 254 (3), 129-136, 2014 | 59 | 2014 |
On the unique evaluation of local lattice parameters by convergent-beam electron diffraction HJ Maier, RR Keller, H Renner, H Mughrabi, A Preston Philosophical Magazine A 74 (1), 23-43, 1996 | 43 | 1996 |
On the onset of low-energy dislocation substructures in fatigue: grain size effects R Keller, W Zielinski, WW Gerberich Materials Science and Engineering: A 113, 267-280, 1989 | 42 | 1989 |
Giant secondary grain growth in Cu films on sapphire DL Miller, MW Keller, JM Shaw, KP Rice, RR Keller, KM Diederichsen AIP Advances 3 (8), 2013 | 40 | 2013 |
Local lattice parameter measurements in a creep-deformed nickel-base superalloy by convergent beam electron diffraction RR Keller, HJ Maier, H Renner, H Mughrabi Scripta metallurgica et materialia 27 (9), 1167-1172, 1992 | 33 | 1992 |
Strain-induced grain growth during rapid thermal cycling of aluminum interconnects RR Keller, RH Geiss, N Barbosa, AJ Slifka, DT Read Metallurgical and Materials Transactions A 38, 2263-2272, 2007 | 31 | 2007 |
Local textures and grain boundaries in voided copper interconnects RR Keller, JA Nucci, DP Field Journal of Electronic Materials 26, 996-1001, 1997 | 30 | 1997 |
Transmission imaging with a programmable detector in a scanning electron microscope BW Caplins, JD Holm, RR Keller Ultramicroscopy 196, 40-48, 2019 | 29 | 2019 |
Transmission electron diffraction from nanoparticles, nanowires and thin films in an SEM with conventional EBSD equipment RH Geiss, RR Keller, DT Read Microscopy and Microanalysis 16 (S2), 1742-1743, 2010 | 27 | 2010 |
Interconnect failure due to cyclic loading RR Keller, R Mönig, CA Volkert, E Arzt, R Schwaiger, O Kraft AIP Conference Proceedings 612 (1), 119-132, 2002 | 24 | 2002 |