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Koneru Ramakrishna
Koneru Ramakrishna
Senior Design and Simulation Engineer, Cirrus Logic, Inc.
E-mail confirmado em ieee.org
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A numerical study of the thermal performance of an impingement heat sink-fin shape optimization
A Shah, BG Sammakia, H Srihari, K Ramakrishna
IEEE transactions on Components and Packaging Technologies 27 (4), 710-717, 2004
792004
Objective evaluation of stubble emission of North India and quantifying its impact on air quality of Delhi
G Beig, SK Sahu, V Singh, S Tikle, SB Sobhana, P Gargeva, ...
Science of The Total Environment 709, 136126, 2020
742020
Size effect on the thermal conductivity of thin metallic films investigated by scanning Joule expansion microscopy
SP Gurrum, WP King, YK Joshi, K Ramakrishna
552008
Thermal sub-modeling of the wirebonded plastic ball grid array package
Z Johnson, K Ramakrishna, B Joiner, M Eyman
Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management …, 1997
471997
A compact approach to on-chip interconnect heat conduction modeling using the finite element method
SP Gurrum, YK Joshi, WP King, K Ramakrishna, M Gall
Journal of Electronic Packaging 130 (3), 2008
432008
Thermal management of handheld telecommunication products
TY Tom Lee, B Chambers, K Ramakrishna
Electronics Cooling 4, 30-33, 1998
251998
Two‐dimensional analysis of electrical breakdown in a nonuniform gap between a wire and a plane
K Ramakrishna, IM Cohen, PS Ayyaswamy
Journal of applied physics 65 (1), 41-50, 1989
211989
Prediction of thermal performance of flip chip-plastic ball grid array (fc-pbga) packages: effect of substrate physical design
K Ramakrishna, TYT Lee
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002
202002
Optimization study for a parallel plate impingement heat sink
A Shah, BG Sammakia, K Srihari, K Ramakrishna
172006
Heat transfer in surface-cooled objects subject to microwave heating
KR Foster, PS Ayyaswamy, T Sundararajan, K Ramakrishna
IEEE Transactions on Microwave Theory and Techniques 30 (8), 1158-1166, 1982
171982
Evaluation of Smear and its effect on the mechanical integrity of plated through hole-inner plane interface in thick printed wiring boards
R Venkatraman, K Ramakrishna, K Knadle, WT Chen, GC Haddon
J. Electron. Packag. 123 (1), 6-15, 2001
162001
Effect of material and design parameters on the stresses induced in a Direct-Chip-Attach package during underfill cure
K Ramakrishna, Z Johnson
Proc. InterPack’97, 15-19, 1997
161997
Effect of non-uniformities and defects on PTH strain during assembly and accelerated thermal cycling
K Ramakrishna
Proceedings of Joint ASME/JSME Conference on Electronic Packaging, 1992, 891-908, 1992
151992
Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications
K Ramakrishna, JR Trent
ASME International Mechanical Engineering Congress and Exposition 18527, 13-21, 1997
141997
Numerical simulation of electron transport through constriction in a metallic thin film
SP Gurrum, YK Joshi, WP King, K Ramakrishna
IEEE electron device letters 25 (10), 696-698, 2004
122004
Impact of on-die discrete heating on thermal performance characteristics of silicon based IC electronic packages
VH Adams, K Ramakrishna
ASME International Mechanical Engineering Congress and Exposition 16530, 99-106, 1999
121999
Thermal performance of an air-cooled plastic ball grid array package in natural and forced convection
K Ramakrishna, TR Thomas, TYT Lee, JR Trent, JV Hause
ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical …, 1998
121998
Plated through holes in thick printed wiring boards: Interaction between design, materials, and assembly processes
K Ramakrishna, WT Chen, GH Thiel, JE Steinwall
ASME APPLIED MECHANICS DIVISION-PUBLICATIONS-AMD 195, 1-1, 1994
121994
Scaling of statistical and physical electromigration characteristics in cu interconnects
M Gall, M Hauschildt, P Justison, K Ramakrishna, R Hernandez, ...
MRS Online Proceedings Library (OPL) 914, 2006
112006
Thermal performance of a ball grid array single package technology solution under natural and forced convection cooling
K Ramakrishna, TR Thomas, TY Lee, JR Trent, JV Hause
Proc. Of ITHERM 1998-Sixth Intersociety Conference on Thermal and Thermo …, 1998
101998
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