Koneru Ramakrishna
Koneru Ramakrishna
Senior Design and Simulation Engineer, Cirrus Logic, Inc.
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A numerical study of the thermal performance of an impingement heat sink-fin shape optimization
A Shah, BG Sammakia, H Srihari, K Ramakrishna
IEEE transactions on Components and Packaging Technologies 27 (4), 710-717, 2004
Objective evaluation of stubble emission of North India and quantifying its impact on air quality of Delhi
G Beig, SK Sahu, V Singh, S Tikle, SB Sobhana, P Gargeva, ...
Science of The Total Environment 709, 136126, 2020
Size effect on the thermal conductivity of thin metallic films investigated by scanning Joule expansion microscopy
SP Gurrum, WP King, YK Joshi, K Ramakrishna
Thermal sub-modeling of the wirebonded plastic ball grid array package
Z Johnson, K Ramakrishna, B Joiner, M Eyman
Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management …, 1997
A compact approach to on-chip interconnect heat conduction modeling using the finite element method
SP Gurrum, YK Joshi, WP King, K Ramakrishna, M Gall
Journal of Electronic Packaging 130 (3), 2008
Thermal management of handheld telecommunication products
TY Tom Lee, B Chambers, K Ramakrishna
Electronics Cooling 4, 30-33, 1998
Two‐dimensional analysis of electrical breakdown in a nonuniform gap between a wire and a plane
K Ramakrishna, IM Cohen, PS Ayyaswamy
Journal of applied physics 65 (1), 41-50, 1989
Prediction of thermal performance of flip chip-plastic ball grid array (fc-pbga) packages: effect of substrate physical design
K Ramakrishna, TYT Lee
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002
Optimization study for a parallel plate impingement heat sink
A Shah, BG Sammakia, K Srihari, K Ramakrishna
Heat transfer in surface-cooled objects subject to microwave heating
KR Foster, PS Ayyaswamy, T Sundararajan, K Ramakrishna
IEEE Transactions on Microwave Theory and Techniques 30 (8), 1158-1166, 1982
Evaluation of Smear and its effect on the mechanical integrity of plated through hole-inner plane interface in thick printed wiring boards
R Venkatraman, K Ramakrishna, K Knadle, WT Chen, GC Haddon
J. Electron. Packag. 123 (1), 6-15, 2001
Effect of material and design parameters on the stresses induced in a Direct-Chip-Attach package during underfill cure
K Ramakrishna, Z Johnson
Proc. InterPack’97, 15-19, 1997
Effect of non-uniformities and defects on PTH strain during assembly and accelerated thermal cycling
K Ramakrishna
Proceedings of Joint ASME/JSME Conference on Electronic Packaging, 1992, 891-908, 1992
Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications
K Ramakrishna, JR Trent
ASME International Mechanical Engineering Congress and Exposition 18527, 13-21, 1997
Numerical simulation of electron transport through constriction in a metallic thin film
SP Gurrum, YK Joshi, WP King, K Ramakrishna
IEEE electron device letters 25 (10), 696-698, 2004
Impact of on-die discrete heating on thermal performance characteristics of silicon based IC electronic packages
VH Adams, K Ramakrishna
ASME International Mechanical Engineering Congress and Exposition 16530, 99-106, 1999
Thermal performance of an air-cooled plastic ball grid array package in natural and forced convection
K Ramakrishna, TR Thomas, TYT Lee, JR Trent, JV Hause
ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical …, 1998
Plated through holes in thick printed wiring boards: Interaction between design, materials, and assembly processes
K Ramakrishna, WT Chen, GH Thiel, JE Steinwall
Scaling of statistical and physical electromigration characteristics in cu interconnects
M Gall, M Hauschildt, P Justison, K Ramakrishna, R Hernandez, ...
MRS Online Proceedings Library (OPL) 914, 2006
Thermal performance of a ball grid array single package technology solution under natural and forced convection cooling
K Ramakrishna, TR Thomas, TY Lee, JR Trent, JV Hause
Proc. Of ITHERM 1998-Sixth Intersociety Conference on Thermal and Thermo …, 1998
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