| 3D stacked IC demonstration using a through silicon via first approach J Van Olmen, A Mercha, G Katti, C Huyghebaert, J Van Aelst, E Seppala, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 182 | 2008 |
| Micro-Raman stress characterization of polycrystalline silicon films grown at high temperature RC Teixeira, I Doi, MBP Zakia, JA Diniz, JW Swart Materials Science and Engineering: B 112 (2-3), 160-164, 2004 | 68 | 2004 |
| Process induced sub-surface damage in mechanically ground silicon wafers Y Yang, K De Munck, RC Teixeira, B Swinnen, B Verlinden, I De Wolf Semiconductor science and technology 23 (7), 075038, 2008 | 47 | 2008 |
| 3D embedding and interconnection of ultra thin (≪ 20 μm) silicon dies F Iker, DS Tezcan, RC Teixeira, P Soussan, P De Moor, E Beyne, K Baert 2007 9th Electronics Packaging Technology Conference, 222-226, 2007 | 37 | 2007 |
| Thermal stability of Ni (Pt) silicide films formed on poly-Si I Doi, RC Teixeira, RE Santos, JA Diniz, JW Swart, SG Santos Filho Microelectronic engineering 82 (3-4), 485-491, 2005 | 15 | 2005 |
| Method for reducing the thickness of substrates RC Teixeira US Patent 7,977,211, 2011 | 14 | 2011 |
| TSV metrology and inspection challenges R Alapati, Y Travaly, J Van Olmen, RC Teixeira, J Vaes, ... 2009 IEEE International Conference on 3D System Integration, 1-4, 2009 | 12 | 2009 |
| Impact of thinning and packaging on a deep submicron CMOS product D Perry, U Ray, S Gu, M Nakamoto, W Sy, K Wang, W Ruythooren, ... Design, Automation & Test in Europe Conference Workshop on 3D Integration …, 2009 | 12 | 2009 |
| Stress analysis on ultra thin ground wafers RC Teixeira, K De Munck, P De Moor, K Baert, B Swinnen, C Van Hoof, ... Journal of Integrated Circuits and Systems 3 (2), 83-89, 2008 | 12 | 2008 |
| Multi-chip module (MCM-D) using thin film technology CB Adamo, A Flacker, W Freitas, RC Teixeira, MO da Silva, ... 2014 29th Symposium on Microelectronics Technology and Devices (SBMicro), 1-4, 2014 | 9 | 2014 |
| Deposition of sacrificial silicon oxide layers by electron cyclotron resonance plasma C Biasotto, AM Daltrini, RC Teixeira, FA Boscoli, JA Diniz, SA Moshkalev Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2007 | 9 | 2007 |
| Development of MCM-D technology with photosensitive benzocyclobutene CB Adamo, A Flacker, HM Cavalcanti, RC Teixeira, ALP Rotondaro, ... 2015 30th Symposium on Microelectronics Technology and Devices (SBMicro), 1-4, 2015 | 8 | 2015 |
| Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies F Iker, T Funaya, RC Teixeira, W Ruythooren 2009 59th Electronic Components and Technology Conference, 1284-1288, 2009 | 8 | 2009 |
| Development of microtransformers using MCM and electronic packaging technologies MM Rocha, ACC Telles, RC Teixeira Proceedings of the 30th Symposium on Integrated Circuits and Systems Design …, 2017 | 7 | 2017 |
| Thickness characterization of ultra thin wafers on carrier RC Teixeira, K De Munck, K Baert, B Swinnen, A Knuttel, P De Moor 2007 9th Electronics Packaging Technology Conference, 238-241, 2007 | 6 | 2007 |
| K, De Munck, P. De Moor, K. Baert, B. Swinnen, C. Van Hoof, and A. Knüettel RC Teixeira J. Int. Circ. and Sys 3 (2), 83-89, 2008 | 5 | 2008 |
| PORTALSI-Portal de Tecnologia e Sistemas de Informação: especificação do front-end recorrendo a use-cases JEQ VAREJÃO, S SANTOS, R TEIXEIRA 5º Congresso Internacional de Gestão da Tecnologia e Sistema de Informação …, 2008 | 5 | 2008 |
| Morphological study of polycrystalline SiGe alloy deposited by vertical LPCVD RC Teixeira, JA Diniz, JW Swart, MBP Zakia Brazilian journal of physics 36, 466-469, 2006 | 5 | 2006 |
| A 4 mm toroidal microtransformer built with wire bonding and MCM technologies F do Nascimento, ACC Telles, MM Rocha, RC Teixeira 2019 34th Symposium on Microelectronics Technology and Devices (SBMicro), 1-4, 2019 | 4 | 2019 |
| Alternative technological development for RF hybridization CA Finardi, A da Fontoura Ponchet, CB Adamo, A Flacker, RC Teixeira, ... Materials Research Express 4 (3), 036305, 2017 | 4 | 2017 |
Antonio L P RotondaroTokyo Electron AmericaE-mail confirmado em us.tel.com
