| Mechanical shock testing and modeling of PC motherboards J Pitarresi, B Roggeman, S Chaparala, P Geng 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 98 | 2004 |
| Room Temperature CW Operation of Short Wavelength Quantum Cascade Lasers Made of Strain Balanced Ga $ _ {\bm x} $ In $ _ {\bm {1-x}} $ As/Al $ _ {\bm y} $ In $ _ {\bm {1-y … F Xie, C Caneau, HP LeBlanc, NJ Visovsky, SC Chaparala, ... IEEE Journal of Selected Topics in Quantum Electronics 17 (5), 1445-1452, 2011 | 48 | 2011 |
| Effect of geometry and temperature cycle on the reliability of WLCSP solder joints SC Chaparala, BD Roggeman, JM Pitarresi, BG Sammakia, J Jackson, ... IEEE transactions on components and packaging technologies 28 (3), 441-448, 2005 | 41 | 2005 |
| Fabrication of 3D-IC interposers J Keech, S Chaparala, A Shorey, G Piech, S Pollard 2013 IEEE 63rd Electronic Components and Technology Conference, 1829-1833, 2013 | 29 | 2013 |
| Methods and apparatus for providing an interposer for interconnecting semiconductor chips SC Chaparala, SC Pollard US Patent 9,472,479, 2016 | 25 | 2016 |
| 63.2: Distinguished Paper: Efficient and Compact Green Laser Incorporating Adaptive Optics for Wide Operating Temperature Range V Bhatia, SJ Gregorski, D Pikula, SC Chaparala, DAS Loeber, J Gollier, ... SID Symposium Digest of Technical Papers 39 (1), 962-965, 2008 | 21 | 2008 |
| Efficient and compact green laser for micro‐projector applications V Bhatia, SJ Gregorski, D Pikula, SC Chaparala, DAS Loeber, J Gollier, ... Journal of the Society for Information Display 17 (3), 271-277, 2009 | 20 | 2009 |
| Dynamic analysis of thin glass under ball drop impact with new metrics L Xue, CR Coble, H Lee, D Yu, S Chaparala, S Park ASME 2013 International Technical Conference and Exhibition on Packaging and …, 2013 | 19 | 2013 |
| Design guidelines for efficient thermal management of mid-infrared quantum cascade lasers SC Chaparala, F Xie, C Caneau, CE Zah, LC Hughes IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 15 | 2011 |
| Nanolubrication of sliding components in adaptive optics used in microprojectors B Bhushan, H Lee, SC Chaparala, V Bhatia Applied surface science 256 (24), 7545-7558, 2010 | 15 | 2010 |
| Experimental and numerical investigation of the reliability of double-sided area array assemblies S Chaparala, JM Pitarresi, S Parupalli, S Mandepudi, M Meilunas | 14 | 2006 |
| Miniature multiple-axes adaptive optics unit employing SIDMs and its application to an efficient green laser module Y Ozeki, T Hata, K Shibatani, F Nagai, N Mori, Y Nakabayashi, N MITSUGI, ... Konica Minolta Technology Report 6, 2009 | 13 | 2009 |
| High power and high temperature continuous-wave operation of distributed Bragg reflector quantum cascade lasers F Xie, CG Caneau, HP LeBlanc, M Ho, J Wang, S Chaparala, LC Hughes, ... Applied Physics Letters 104 (7), 071109, 2014 | 12 | 2014 |
| Edge bonded optical packages VA Bhagavatula, SC Chaparala, J Himmelreich, LC Hughes Jr US Patent 8,102,887, 2012 | 12 | 2012 |
| A parametric solder joint reliability model for wafer level-chip scale package J Pitarresi, S Chaparala, B Sammakia, L Nguyen, V Patwardhan, L Zhang, ... 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 12 | 2002 |
| Reliability of 4.6-µm quantum cascade lasers under continuous-wave room-temperature operation F Xie, CG Caneau, HP LeBlanc, CA Page, SC Chaparala, OD Deichmann, ... Optical Engineering 49 (11), 111104, 2010 | 11 | 2010 |
| Dynamics behavior of flat glass panels under impact conditions: Experiments and numerical modeling S Chaparala, L Xue, D Yu, S Park Journal of the Society for Information Display 23 (3), 97-106, 2015 | 9 | 2015 |
| Effect of dwell times and ramp rates on the thermal cycling reliability of Pb-free wafer-level chip scale packages: Experiments and modeling S Chaparala, JM Pitarresi, M Meilunas ASME 2006 International Mechanical Engineering Congress and Exposition, 59-65, 2006 | 9 | 2006 |
| Methods for passively aligning opto-electronic component assemblies on substrates VA Bhagavatula, SC Chaparala, J Himmelreich US Patent 8,036,508, 2011 | 8 | 2011 |
| Methods and apparatus for providing an interposer for interconnecting semiconductor chips SC Chaparala, SC Pollard US Patent 9,917,045, 2018 | 7 | 2018 |
