| Thickness and surface measurement of transparent thin-film layers using white light scanning interferometry combined with reflectometry T Jo, KR Kim, SR Kim, HJ Pahk Journal of the Optical Society of Korea 18 (3), 236-243, 2014 | 37 | 2014 |
| Residual vibration reduction of white-light scanning interferometry by input shaping JI Mun, T Jo, T Kim, HJ Pahk Optics Express 23 (1), 464-470, 2015 | 26 | 2015 |
| 3D measurement of TSVs using low numerical aperture white-light scanning interferometry T Jo, S Kim, H Pahk Journal of the Optical Society of Korea 17 (4), 317-322, 2013 | 26 | 2013 |
| Critical dimension measurement of transparent film layers by multispectral imaging S Kwon, N Kim, T Jo, HJ Pahk Optics Express 22 (14), 17370-17381, 2014 | 14 | 2014 |
| Optical spectrum augmentation for machine learning powered spectroscopic ellipsometry I Kim, S Gwak, Y Bae, T Jo Optics Express 30 (10), 16909-16920, 2022 | 5 | 2022 |
| Machine learning aided profile measurement in high-aspect-ratio nanostructures I Kim, Y Bae, S Gwak, E Kum, T Jo Modeling Aspects in Optical Metrology VIII 11783, 64-71, 2021 | 5 | 2021 |
| Measurement of 3D printed structure using a peak detection method in dispersive interferometry J Kim, T Jo, N Kim, D Kwon Journal of Electronic Materials 44, 792-796, 2015 | 4 | 2015 |
| A Study on TSV (Through-Silicon-Via) depth measurement using white-light scanning interferometry TY Jo, YM Hwang, SR Kim 한국생산제조학회 학술발표대회 논문집, 69-69, 2012 | 2 | 2012 |
| Reduction in on-product overlay random error using machine learning algorithm G Song, S Kim, S Park, T Jo, E Kum, J Hwang, S Lee Metrology, Inspection, and Process Control XXXVI 12053, 532-539, 2022 | 1 | 2022 |
| Machine learning aided process control: critical dimension uniformity control of etching process in 1z nm DRAM T Jo, I Choi, D Choi, Y Bae, S Byoun, I Kim, S Lee, C Choi, E Kum, Y Kang, ... Metrology, Inspection, and Process Control for Semiconductor Manufacturing …, 2021 | 1 | 2021 |
| Automatic Beam Optimization Method for Scanning Electron Microscopy based on Electron Beam Kernel Estimation K Kim, Y Cho, J Cho, J Park, J Wang, S Jeong, J Lee, Y Hwang, J Kim, ... | | 2024 |
| Exploiting spatial characteristic of wafer for effective OCW: area partitioning OCW G Song, D Kang, S Kim, S Park, T Jo, E Kum, J Lee, D Park, D Kim, S Uh, ... Metrology, Inspection, and Process Control XXXVII 12496, 950-955, 2023 | | 2023 |
| Method of training deep learning model for predicting pattern characteristics and method of manufacturing semiconductor device BAE Yoonsung, G Seungho, K Kim, S Byoun, G Song, Y Shin, K Yun, ... US Patent App. 17/245,173, 2022 | | 2022 |
| Three-dimensional shape measuring device capable of measuring color information TY Jo, YM Hwang, SR Kim, SS Kang, HJ Pahk US Patent 9,696,144, 2017 | | 2017 |
Heui Jae PahkProfessor of Mechanical Engineering, Seoul National UniversityE-mail confirmado em snu.ac.kr
