| Effect of citric acid on the synthesis of nano-crystalline yttria stabilized zirconia powders by nitrate–citrate process KA Singh, LC Pathak, SK Roy Ceramics International 33 (8), 1463-1468, 2007 | 121 | 2007 |
| Co-packaged photonics for high performance computing: status, challenges and opportunities R Mahajan, X Li, J Fryman, Z Zhang, S Nekkanty, P Tadayon, J Jaussi, ... Journal of Lightwave Technology 40 (2), 379-392, 2021 | 46 | 2021 |
| Effect of self-assembled monolayers on charge injection and transport in poly (3-hexylthiophene)-based field-effect transistors at different channel length scales KA Singh, TL Nelson, JA Belot, TM Young, NR Dhumal, T Kowalewski, ... ACS applied materials & interfaces 3 (8), 2973-2978, 2011 | 40 | 2011 |
| Dependence of field-effect mobility and contact resistance on nanostructure in regioregular poly (3-hexylthiophene) thin film transistors KA Singh, G Sauve, R Zhang, T Kowalewski, RD McCullough, LM Porter Applied Physics Letters 92 (26), 2008 | 38 | 2008 |
| 8 Tbps co-packaged FPGA and silicon photonics optical IO K Hosseini, E Kok, SY Shumarayev, CP Chiu, A Sarkar, A Toda, Y Ke, ... 2021 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2021 | 31 | 2021 |
| Planarization of Polymeric Field‐Effect Transistors: Improvement of Nanomorphology and Enhancement of Electrical Performance KA Singh, T Young, RD McCullough, T Kowalewski, LM Porter Advanced Functional Materials 20 (14), 2216-2221, 2010 | 30 | 2010 |
| 5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O K Hosseini, E Kok, SY Shumarayev, D Jeong, A Chan, A Katzin, S Liu, ... 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022 | 9 | 2022 |
| Ic die package thermal spreader and emi shield comprising graphite D Mallik, M Modi, S Ganesan, E Cetegen, O Karhade, R Mahajan, ... US Patent App. 16/287,665, 2020 | 3 | 2020 |
| Coupled cooling fins in ultra-small systems A Uppal, O Karhade, R Viswanath, JY Chang, W Tang, N Deshpande, ... US Patent 11,574,851, 2023 | 2 | 2023 |
| Thermal management solutions for integrated circuit packages KA Singh, O Karhade, N Deshpande, M Modi, E Cetegen, A Uppal, ... US Patent 11,545,407, 2023 | 1 | 2023 |
| Organic Field‐Effect Transistors: Planarization of Polymeric Field‐Effect Transistors: Improvement of Nanomorphology and Enhancement of Electrical Performance (Adv. Funct … KA Singh, T Young, RD McCullough, T Kowalewski, LM Porter Advanced Functional Materials 20 (14), 2010 | 1 | 2010 |
| Thermal interface structures for optical communication devices CP Chiu, K Hosseini, TN Tran, YF Kok, KA Singh, X Li, MT Ferrari, ... US Patent App. 17/338,928, 2022 | | 2022 |
| Crystalline carbon heat spreading materials for ic die hot spot reduction O Karhade, N Deshpande, M Modi, E Cetegen, A Uppal, D Mallik, ... US Patent App. 16/287,668, 2020 | | 2020 |
| Charge injection and transport in regioregular poly (3-hexylthiophene)-based field-effect transistors KA Singh Carnegie Mellon University, 2010 | | 2010 |
Tomasz KowalewskiProfessor of Chemistry, Carnegie Mellon UniversityVerified email at andrew.cmu.edu
