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- Gang WangNingbo University, Lanzhou University, Shanghai Institute of Microsystem and InformationE-mail confirmado em nbu.edu.cn
- Yongfeng MeiFudan UniversityE-mail confirmado em fudan.edu.cn
- Sheng BiDalian University of TechnologyE-mail confirmado em dlut.edu.cn
- Paul K ChuChair Professor of Materials Engineering, City University of Hong KongE-mail confirmado em cityu.edu.hk
- ENMING SONGFudan UniversityE-mail confirmado em fudan.edu.cn
- John A. RogersSimpson/Querrey Professor, Northwestern UniversityE-mail confirmado em northwestern.edu
- Xh Zheng中国科学院上海位系统与信息技术研究所E-mail confirmado em mail.sim.ac.cn
- Shiwei TangAssociate Professor, School of Physical Science and Technology, Ningbo UniversityE-mail confirmado em nbu.edu.cn
- Xinge YuAssociate Professor of Biomedical Engineering, City University of Hong KongE-mail confirmado em cityu.edu.hk
- Xin NingAssistant Professor of Aerospace Engineering; University of Illinois at Urbana-ChampaignE-mail confirmado em illinois.edu
- Hao Zhang (张昊)Department of Chemistry, Tsinghua UniversityE-mail confirmado em mail.tsinghua.edu.cn
- Jahyun KooAssociate Professor, Korea UniversityE-mail confirmado em korea.ac.kr
- Li ZhengShanghai Institute of Microsystem and Information Technology, Chinese Academy of SciencesE-mail confirmado em mail.sim.ac.cn
- Ziao TianShanghai Institute of Microsystem And Information TechnologyE-mail confirmado em mail.sim.ac.cn
- Jan-Kai ChangCenter for Bio-Integrated Electronics, Northwestern UniversityE-mail confirmado em northwestern.edu
- GaoShan HuangProfessor, Fudan UniversityE-mail confirmado em fudan.edu.cn
- Zhaoqian XieProfessor of Engineering Mechanics, Dalian University of TechnologyE-mail confirmado em dlut.edu.cn
- Zengfeng DiShanghai Institute of Microsystem And Information Technology