The 2017 Plasma Roadmap: Low temperature plasma science and technology I Adamovich, SD Baalrud, A Bogaerts, PJ Bruggeman, M Cappelli, ...
Journal of Physics D: Applied Physics 50 (32), 323001, 2017
958 2017 Reactor for plasma-based atomic layer etching of materials GS Oehrlein, D Metzler
US Patent 9,620,382, 2017
403 2017 Study of the -to- etch selectivity mechanism in inductively coupled fluorocarbon plasmas and a comparison with the -to-Si mechanism M Schaepkens, T Standaert, NR Rueger, PGM Sebel, GS Oehrlein, ...
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 17 (1 …, 1999
354 1999 Role of fluorocarbon film formation in the etching of silicon, silicon dioxide, silicon nitride, and amorphous hydrogenated silicon carbide T Standaert, C Hedlund, EA Joseph, GS Oehrlein, TJ Dalton
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 22 (1 …, 2004
332 2004 Role of steady state fluorocarbon films in the etching of silicon dioxide using CHF3 in an inductively coupled plasma reactor NR Rueger, JJ Beulens, M Schaepkens, MF Doemling, JM Mirza, ...
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 15 (4 …, 1997
324 1997 High density fluorocarbon etching of silicon in an inductively coupled plasma: Mechanism of etching through a thick steady state fluorocarbon layer T Standaert, M Schaepkens, NR Rueger, PGM Sebel, GS Oehrlein, ...
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 16 (1 …, 1998
307 1998 Atomic layer etching at the tipping point: an overview GS Oehrlein, D Metzler, C Li
ECS Journal of Solid State Science and Technology 4 (6), N5041, 2015
275 2015 Fluorocarbon high‐density plasmas. I. Fluorocarbon film deposition and etching using CF4 and CHF3 GS Oehrlein, Y Zhang, D Vender, M Haverlag
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 12 (2 …, 1994
271 1994 Surface chemistry studies of copper chemical mechanical planarization J Hernandez, P Wrschka, GS Oehrlein
Journal of the Electrochemical Society 148 (7), G389, 2001
250 2001 Silicon etching mechanisms in a CF4 /H2 glow discharge GS Oehrlein, HL Williams
Journal of applied physics 62 (2), 662-672, 1987
234 1987 Plasma-polymer interactions: A review of progress in understanding polymer resist mask durability during plasma etching for nanoscale fabrication GS Oehrlein, RJ Phaneuf, DB Graves
Journal of Vacuum Science & Technology B 29 (1), 2011
227 2011 Fluorocarbon high‐density plasmas. II. Silicon dioxide and silicon etching using CF4 and CHF3 GS Oehrlein, Y Zhang, D Vender, O Joubert
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 12 (2 …, 1994
214 1994 Dry etching damage of silicon: A review GS Oehrlein
Materials Science and Engineering: B 4 (1-4), 441-450, 1989
208 1989 Near‐surface damage and contamination after CF 4/H 2 reactive ion etching of Si GS Oehrlein, RM Tromp, JC Tsang, YH Lee, EJ Petrillo
Journal of the Electrochemical Society 132 (6), 1441, 1985
206 1985 Fluorocarbon assisted atomic layer etching of SiO2 using cyclic Ar/C4F8 plasma D Metzler, RL Bruce, S Engelmann, EA Joseph, GS Oehrlein
Journal of Vacuum Science & Technology A 32 (2), 2014
205 2014 Chemical dry etching of silicon nitride and silicon dioxide using CF4 /O2 /N2 gas mixtures BEE Kastenmeier, PJ Matsuo, JJ Beulens, GS Oehrlein
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 14 (5 …, 1996
204 1996 The 2022 Plasma Roadmap: low temperature plasma science and technology I Adamovich, S Agarwal, E Ahedo, LL Alves, S Baalrud, N Babaeva, ...
Journal of Physics D: Applied Physics 55 (37), 373001, 2022
194 2022 Study of sidewall passivation and microscopic silicon roughness phenomena in chlorine‐based reactive ion etching of silicon trenches GS Oehrlein, JF Rembetski, EH Payne
Journal of Vacuum Science & Technology B: Microelectronics Processing and …, 1990
166 1990 Properties of inductively coupled plasmas. II. Plasma chemistry and reaction mechanism for modeling of discharges AV Vasenkov, X Li, GS Oehrlein, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 22 (3 …, 2004
162 2004 A review of SiO2 etching studies in inductively coupled fluorocarbon plasmas M Schaepkens, GS Oehrlein
Journal of The Electrochemical Society 148 (3), C211, 2001
154 2001