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Richard W. Bonner III
Richard W. Bonner III
Advanced Cooling Technologies, Inc.
Verified email at 1-act.com
Title
Cited by
Cited by
Year
Roles of atomic restructuring in interfacial phonon transport
S Shin, M Kaviany, T Desai, R Bonner
Physical Review B 82 (8), 081302, 2010
852010
Correlation for dropwise condensation heat transfer: Water, organic fluids, and inclination
RW Bonner III
International Journal of Heat and Mass Transfer 61, 245-253, 2013
482013
Dropwise condensation life testing of self assembled monolayers
RW Bonner III
International Heat Transfer Conference 49378, 221-226, 2010
402010
Intermediate temperature fluids life tests-Experiments
W Anderson, R Bonner, P Dussinger, J Hartenstine, D Sarraf, I Locci
5th International Energy Conversion Engineering Conference and Exhibit …, 2007
352007
An innovative passive cooling method for high performance light-emitting diodes
A Fan, R Bonner, S Sharratt, YS Ju
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012
332012
LOOP Thermosyphon design for cooling of large area, high heat flux sources
JR Hartenstine, RW Bonner III, JR Montgomery, T Semenic
International Electronic Packaging Technical Conference and Exhibition 42770 …, 2007
322007
High temperature titanium/water and monel/water heat pipes
W Anderson, P Dussinger, R Bonner, D Sarraf
4th International Energy Conversion Engineering Conference and Exhibit …, 2006
302006
Experimental, numerical and analytic study of unconstrained melting in a vertical cylinder with a focus on mushy region effects
C Pan, J Charles, N Vermaak, C Romero, S Neti, Y Zheng, CH Chen, ...
International Journal of Heat and Mass Transfer 124, 1015-1024, 2018
282018
Laminar forced convection heat transfer from laterally perforated-finned heat sinks
MR Shaeri, R Bonner
Applied Thermal Engineering 116, 406-418, 2017
282017
Semiconductor having integrally-formed enhanced thermal management
RW Bonner III, T Desai
US Patent App. 13/316,906, 2013
262013
Vapor chambers with hydrophobic and biphilic evaporators in moderate to high heat flux applications
MR Shaeri, D Attinger, RW Bonner III
Applied Thermal Engineering 130, 83-92, 2018
252018
Feasibility study of a vapor chamber with a hydrophobic evaporator substrate in high heat flux applications
MR Shaeri, D Attinger, R Bonner
International Communications in Heat and Mass Transfer 86, 199-205, 2017
252017
Dropwise condensation on surfaces with graded hydrophobicity
RW Bonner III
Heat Transfer Summer Conference 43581, 491-495, 2009
232009
Dropwise condensation in vapor chambers
RW Bonner
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010
202010
Analytical heat transfer model for laterally perforated-finned heat sinks
MR Shaeri, RW Bonner III
International Journal of Heat and Mass Transfer 131, 1164-1173, 2019
192019
Dropwise condensation on superhydrophobic microporous wick structures
SH Hoenig, RW Bonner
Journal of Heat Transfer 140 (7), 2018
192018
High heat flux heat pipes embedded in metal core printed circuit boards for LED thermal management
D Pounds, RW Bonner
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
162014
Cost estimation and sensitivity analysis of a latent thermal energy storage system for supplementary cooling of air cooled condensers
C Pan, N Vermaak, C Romero, S Neti, S Hoenig, CH Chen, R Bonner III
Applied energy 224, 52-68, 2018
152018
Heat transfer and pressure drop in laterally perforated-finned heat sinks across different flow regimes
MR Shaeri, R Bonner
International Communications in Heat and Mass Transfer 87, 220-227, 2017
142017
Die level thermal storage for improved cooling of pulsed devices
RW Bonner, T Desai, F Gao, X Tang, T Palacios, S Shin, M Kaviany
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011
142011
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