| Experimental observation of high intrinsic thermal conductivity of AlN Z Cheng, YR Koh, A Mamun, J Shi, T Bai, K Huynh, L Yates, Z Liu, R Li, ... Physical Review Materials 4 (4), 044602, 2020 | 118 | 2020 |
| Low thermal boundary resistance interfaces for GaN-on-diamond devices L Yates, J Anderson, X Gu, C Lee, T Bai, M Mecklenburg, T Aoki, ... ACS applied materials & interfaces 10 (28), 24302-24309, 2018 | 118 | 2018 |
| Heterogeneous integration at fine pitch (≤ 10 µm) using thermal compression bonding AA Bajwa, SC Jangam, S Pal, N Marathe, T Bai, T Fukushima, M Goorsky, ... 2017 IEEE 67th electronic components and technology conference (ECTC), 1276-1284, 2017 | 100 | 2017 |
| Direct visualization of thermal conductivity suppression due to enhanced phonon scattering near individual grain boundaries A Sood, R Cheaito, T Bai, H Kwon, Y Wang, C Li, L Yates, T Bougher, ... Nano letters 18 (6), 3466-3472, 2018 | 96 | 2018 |
| Integration of polycrystalline Ga2O3 on diamond for thermal management Z Cheng, VD Wheeler, T Bai, J Shi, MJ Tadjer, T Feygelson, KD Hobart, ... Applied Physics Letters 116 (6), 2020 | 88 | 2020 |
| Simultaneous determination of the lattice thermal conductivity and grain/grain thermal resistance in polycrystalline diamond J Anaya, T Bai, Y Wang, C Li, M Goorsky, TL Bougher, L Yates, Z Cheng, ... Acta Materialia 139, 215-225, 2017 | 80 | 2017 |
| GaN-On-Diamond HEMT Technology With TAVG = 176°C at PDC,max = 56 W/mm Measured by Transient Thermoreflectance Imaging MJ Tadjer, TJ Anderson, MG Ancona, PE Raad, P Komarov, T Bai, ... IEEE Electron Device Letters 40 (6), 881-884, 2019 | 71 | 2019 |
| Thermal boundary conductance across heteroepitaxial ZnO/GaN interfaces: assessment of the phonon gas model JT Gaskins, G Kotsonis, A Giri, S Ju, A Rohskopf, Y Wang, T Bai, E Sachet, ... Nano letters 18 (12), 7469-7477, 2018 | 70 | 2018 |
| Probing growth-induced anisotropic thermal transport in high-quality CVD diamond membranes by multifrequency and multiple-spot-size time-domain thermoreflectance Z Cheng, T Bougher, T Bai, SY Wang, C Li, L Yates, BM Foley, M Goorsky, ... ACS applied materials & interfaces 10 (5), 4808-4815, 2018 | 67 | 2018 |
| Tunable thermal energy transport across diamond membranes and diamond–Si interfaces by nanoscale graphoepitaxy Z Cheng, T Bai, J Shi, T Feng, Y Wang, M Mecklenburg, C Li, KD Hobart, ... ACS applied materials & interfaces 11 (20), 18517-18527, 2019 | 60 | 2019 |
| Thermal conductance across harmonic-matched epitaxial Al-sapphire heterointerfaces Z Cheng, YR Koh, H Ahmad, R Hu, J Shi, ME Liao, Y Wang, T Bai, R Li, ... Communications Physics 3 (1), 115, 2020 | 57 | 2020 |
| Wafer-scale black arsenic–phosphorus thin-film synthesis validated with density functional perturbation theory predictions EP Young, J Park, T Bai, C Choi, RH DeBlock, M Lange, S Poust, J Tice, ... ACS Applied Nano Materials 1 (9), 4737-4745, 2018 | 44 | 2018 |
| Bulk-like intrinsic phonon thermal conductivity of micrometer-thick AlN films YR Koh, Z Cheng, A Mamun, MS Bin Hoque, Z Liu, T Bai, K Hussain, ... ACS applied materials & interfaces 12 (26), 29443-29450, 2020 | 41 | 2020 |
| Phonon scattering effects from point and extended defects on thermal conductivity studied via ion irradiation of crystals with self-impurities EA Scott, K Hattar, CM Rost, JT Gaskins, M Fazli, C Ganski, C Li, T Bai, ... Physical Review Materials 2 (9), 095001, 2018 | 39 | 2018 |
| Orders of magnitude reduction in the thermal conductivity of polycrystalline diamond through carbon, nitrogen, and oxygen ion implantation EA Scott, K Hattar, JL Braun, CM Rost, JT Gaskins, T Bai, Y Wang, ... Carbon 157, 97-105, 2020 | 35 | 2020 |
| Exfoliation of β-Ga2O3 along a non-cleavage plane using helium ion implantation ME Liao, Y Wang, T Bai, MS Goorsky ECS Journal of Solid State Science and Technology 8 (11), P673, 2019 | 21 | 2019 |
| Strain Recovery and Defect Characterization in Mg‐Implanted Homoepitaxial GaN on High‐Quality GaN Substrates Y Wang, K Huynh, ME Liao, HM Yu, T Bai, J Tweedie, MH Breckenridge, ... physica status solidi (b) 257 (4), 1900705, 2020 | 17 | 2020 |
| Diamond Seed Size and the Impact on Chemical Vapor Deposition Diamond Thin Film Properties T Bai, Y Wang, TI Feygelson, MJ Tadjer, KD Hobart, NJ Hines, L Yates, ... ECS Journal of Solid State Science and Technology 9 (5), 053002, 2020 | 12 | 2020 |
| Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding MS Goorsky, K Schjølberg-Henriksen, B Beekley, T Bai, K Mani, ... Japanese Journal of Applied Physics 57 (2S1), 02BC03, 2017 | 11 | 2017 |
| Simultaneous evaluation of heat capacity and in-plane thermal conductivity of nanocrystalline diamond thin films L Yates, Z Cheng, T Bai, K Hobart, M Tadjer, TI Feygelson, BB Pate, ... Nanoscale and Microscale Thermophysical Engineering 25 (3-4), 166-178, 2021 | 6 | 2021 |
