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Co-authors
Lei HuangShenzhen UniversityVerified email at szu.edu.cn- Y. T. ChanRoyal Military College of CanadaVerified email at rmc.ca
- Wing-Kin MaDepartment of Electronic Engineering, The Chinese University of Hong KongVerified email at ieee.org
- W.-Q. WangProfessor of University of Electronic Science and Technology of China, Chengdu, ChinaVerified email at uestc.edu.cn
- Wen-Jun ZengUniversity of Michigan, Ann ArborVerified email at umich.edu
- Cheng QianAnalytics Center of Excellence, IQVIAVerified email at us.imshealth.com
- Kefei LiuDepartment of Biostatistics, Epidemiology and Informatics, University of PennsylvaniaVerified email at pennmedicine.upenn.edu
- Hongyang Chen(陈红阳)Zhejiang Lab, ChinaVerified email at ieee.org
- Joćo Paulo Carvalho Lustosa da CostaHamm-Lippstadt University of Applied SciencesVerified email at hshl.de
- Dominic KC HoUniversity of MissouriVerified email at missouri.edu
- Henry ChungChair Professor of Electrical Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Yuantao GuDepartment of Electronic Engineering, Tsinghua UniversityVerified email at tsinghua.edu.cn
- S. Y. Ron HuiUniversity of Hong Kong & Imperial College LondonVerified email at eee.hku.hk
- Jun ZhengUniversity of Texas at AustinVerified email at utexas.edu
- Hongqing LiuChongqing University of Posts and TelecommunicationsVerified email at cqupt.edu.cn
- Guoliang XingThe Chinese University of Hong KongVerified email at ie.cuhk.edu.hk
- Bin LiaoShenzhen UniversityVerified email at szu.edu.cn
- Jian LiElectrical, University of Florida, University of Kentucky, Ohio State UniversityVerified email at dsp.ufl.edu
- Nikolaos SidiropoulosLouis T. Rader Professor and Chair, Electrical & Computer Engineering, University of VirginiaVerified email at virginia.edu
- Fuxi WenTsinghua UniversityVerified email at tsinghua.edu.cn
Hing Cheung So
Verified email at ee.cityu.edu.hk - Homepage